- CL(IDD): 11 cycles
- Row Cycle Time (tRCmin): 48.125ns (min.)
- Refresh to Active/Refresh Command Time (tRFCmin): 260ns (min.)
- Row Active Time (tRASmin): 35ns (min.)
- Maximum Operating Power: (1.35V) = 2.376 W*
- UL Rating: 94 V – 0
- Operating Temperature: 0°C to 85°C
- Storage Temperature -55°C to +100°C
- JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~1.575V) Power Supply
- VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
- 800MHz fCK for 1600Mb/sec/pin
- 8 independent internal bank
- Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5
- Programmable Additive Latency: 0, CL – 2, or CL – 1 clock
- 8-bit pre-fetch
- Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] Bi-directional
- Differential Data Strobe
- Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE ≤ 95°C
- Asynchronous Reset
- PCB: Height1.18” (30mm), double sided component
- Lead Free RoHS Compliant
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